View RJK0316DSP_4240958.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

RJK0316DSP
Silicon N Channel Power MOS FET Power Switching
REJ03G1598-0300 Rev.3.00 Oct 16, 2007
Features
* * * * * High speed switching Capable of 4.5 V gate drive Low drive current High density mounting Low on-resistance RDS(on) = 5.3 m typ. (at VGS = 10 V)
Outline
RENESAS Package code: PRSP0008DD-D (Package name: SOP-8)
5 76 34 4 G 5678 DDDD 1, 2, 3 Source 4 Gate 5, 6, 7, 8 Drain
8
12
SSS 123
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel to ambient thermal impedance Channel temperature Storage temperature Symbol VDSS VGSS ID ID(pulse) IDR IAP Note 2 EAR Note 2 Pch Note3 ch-a Note3 Tch Tstg
Note1
Ratings 30 +16/-12 16 128 16 16 25.6 2.0 62.5 150 -55 to +150
Unit V V A A A A mJ W C/W C C
Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tch = 25C, Rg 50 3. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 1 of 7
RJK0316DSP
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Gate Resistance Total gate charge Gate to source charge Gate to drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Notes: 4. Pulse test Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDF trr Min 30 -- -- 1.2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 5.3 7.2 40 2080 650 100 1.4 13.8 5.3 2.9 6.5 5.0 45 4.0 0.81 30 Max -- 0.1 1 2.5 6.4 9.4 -- -- -- -- -- -- -- -- -- -- -- -- 1.06 -- Unit V A A V m m S pF pF pF nC nC nC ns ns ns ns V ns Test Conditions ID = 10 mA, VGS = 0 VGS = +16/-12 V, VDS = 0 VDS = 30 V, VGS = 0 VDS = 10 V, ID = 1 mA ID = 8 A, VGS = 10 V Note4 ID = 8 A, VGS = 4.5 V Note4 ID = 8 A, VDS = 10 V Note4 VDS = 10 V VGS = 0 f = 1 MHz VDD = 10 V VGS = 4.5 V ID = 16 A VGS = 10 V, ID = 8 A VDD 10 V RL = 1.25 Rg = 4.7 IF = 16 A, VGS = 0 Note4 IF = 16 A, VGS = 0 diF/ dt = 100 A/ s
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 2 of 7
RJK0316DSP
Main Characteristics
Power vs. Temperature Derating
4.0 500 Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW 10 s
10 s
Maximum Safe Operation Area
Channel Dissipation Pch (W)
100
Drain Current ID (A)
3.0
PW
1m
10
10
DC
=1
s
0
s
Op
0m
s
2.0
era
tio
1 Operation in
this area is limited by RDS(on)
n(
PW
1 Note 0s 5 )
1.0
0.1 0.01 0.1
Ta = 25 C 1 shot Pulse
0
50
100
150
200
0.3
1
3
10
30
100
Ambient Temperature Ta (C)
Drain to Source Voltage VDS (V)
Note 5 : When using the glass epoxy board (FR4 40x40x1.6 mm)
Typical Output Characteristics
50 10 V 50 3.0 V
Typical Transfer Characteristics
V DS = 10 V Pulse Test
Drain Current ID (A)
7V
Drain Current ID (A)
40
2.8 V
40
30 2.6 V 20
30 25C Tc = 75C 10 -25C
20
10
VGS = 2.4 V
Pulse Test
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage VDS (V)
Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current
Drain to Source On State Resistance RDS(on) (m)
100 Pulse Test 50
Drain to Source Saturation Voltage vs. Gate to Source Voltage
Drain to Source Voltage VDS(on) (mV)
200 Pulse Test 160
20 10 VGS = 4.5 V 5 10 V 2 1 1 3 10 30 100 300 1000
120
80 ID = 10 A 40 5A 2A 0 4 8 12 16 20
Gate to Source Voltage VGS (V)
Drain Current ID (A)
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 3 of 7
RJK0316DSP
Static Drain to Source on State Resistance vs. Temperature Forward Transfer Admittance vs. Drain Current
Drain to Source On State Resistance RDS(on) (m)
12 Pulse Test 10 8 VGS = 4.5 V 5 A, 10 A 20 A
Forward Transfer Admittance |yfs| (S)
1000 300 100 30 10 3 1 0.3 0.1 0.1 0.3 1 3 VDS = 10 V Pulse Test 10 30 100 25C 75C Tc = -25C
6 ID = 5 A, 10 A, 20 A 4 2 -25 10 V
0
25
50
75
100 125 150
Case Temperature Tc (C)
Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage
10000 3000 Ciss
Body Drain Diode Reverse Recovery Time
100
Reverse Recovery Time trr (ns)
50
Capacitance C (pF)
1000 Coss 300 100 30 10 0 Crss
20 di/dt = 100 A/s VGS = 0, Ta = 25C 0.3 1 3 10 30 100
10 0.1
VGS = 0 f = 1 MHz 5 10 15 20 25 30
Reverse Drain Current IDR (A)
Drain to Source Voltage VDS (V)
Dynamic Input Characteristics
Switching Characteristics
20 1000
Drain to Source Voltage VDS (V)
50
Gate to Source Voltage VGS (V)
ID = 16 A
VGS 30 VDS VDD = 25 V 10 V 5V 12
Switching Time t (ns)
40
16
300 100 30 tf 10 3 1 0.1 td(on) tr
td(off)
20
8
10
VDD = 25 V 10 V 5V 10 20 30 40
4 0 50
VGS = 10 V, VDS = 10 V Rg = 4.7 , duty 1 % 0.3 1 3 10 30 100
0
Gate Charge Qg (nc)
Drain Current ID (A)
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 4 of 7
RJK0316DSP
Reverse Drain Current vs. Source to Drain Voltage
Repetitive Avalanche Energy EAR (mJ)
50 50 IAP = 16 A VDD = 15 V duty < 0.1 % Rg > 50
Maximum Avalanche Energy vs. Channel Temperature Derating
Reverse Drain Current IDR (A)
10 V 40 5V
40
30
VGS = -5, 0 V
30
20
20
10 Pulse Test 0 0.4 0.8 1.2 1.6 2.0
10 0 25
50
75
100
125
150
Source to Drain Voltage VSD (V)
Channel Temperature Tch (C)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance s (t)
10
1
D=1 0.5
0.2 0.1
0.1
0.05
0.02
0.01
0.01
ch - f(t) = s (t) x ch - f ch - f = 83.3C/W, Ta = 25C When using the glass epoxy board (FR4 40x40x1.6 mm)
pu lse
PDM PW T
0.001
1
D=
t sho
PW T
0.0001 10
100
1m
10 m
100 m
1
10
100
1000
10000
Pulse Width PW (S) Avalanche Test Circuit
L IAP Monitor Rg Vin 15 V D. U. T VDD IAP VDS ID 50 VDD
Avalanche Waveform
EAR = 1 2 L * IAP2 * VDSS VDSS - VDD V(BR)DSS
VDS Monitor
0
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 5 of 7
RJK0316DSP
Switching Time Test Circuit
Vin Monitor Rg D.U.T. RL Vin Vin 10 V VDS = 10 V Vout 10% 10% 90% td(on) tr 90% td(off) tf 10% Vout Monitor
Switching Time Waveform
90%
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 6 of 7
RJK0316DSP
Package Dimensions
Package Name SOP-8 JEITA Package Code P-SOP8-3.95 x 4.9-1.27 RENESAS Code PRSP0008DD-D Previous Code FP-8DAV MASS[Typ.] 0.085g
*1 D
F
8
5
*2 E HE
bp
Index mark
1
Z e
4
* 3 bp xM
c
Terminal cross section (Ni/Pd/Au plating)
NOTE) 1. DIMENSIONS "*1(Nom)" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
Reference Dimension in Millimeters Symbol
Min
L1
L
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Nom Max 4.90 5.3 3.95
A
0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25
A1
y
Detail F
0 8 5.80 6.10 6.20 1.27 0.25 0.1 0.75 0.40 0.60 1.27 1.08
Ordering Information
Part Name RJK0316DSP-00-J0 Note: Quantity 2500 pcs Taping Shipping Container
For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
REJ03G1598-0300 Rev.3.00 Oct 16, 2007 Page 7 of 7
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0

▲Up To Search▲

Price & Availability of RJK0316DSP

	To Download RJK0316DSP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .